page 1 formosa ms chip zener diode 1 2 2 2 2 3 4~5 6 6 7 8 8 9 list list................................................................................................. package outline............................................................................... features.......................................................................................... maximum ratings ............................................................................. electrical characteristics................................................................... rating and characteristic curves........................................................ pinning information........................................................................... suggested solder pad layout............................................................. packing information.......................................................................... reel packing.................................................................................... suggested thermal profiles for soldering processes............................. high reliability test capabilities........................................................... mechanical data............................................................................... http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 zgfm206v8b thru zgfm20200b document id issued date revised date revision page. ds-121729 2009/02/10 2010/04/12 b 9
package outline page 2 2.0w surface mount zener diodes - 6.8v-200v parameter conditions symbol v f p d min. typ. max. 1.20 2.0 unit v w storage temperature range operating junction temperature range t stg t j -55 -65 +150 +175 o c o c maximum ratings (at t =25 c unless otherwise noted) a o forward voltage power dissipation i = 200 ma f formosa ms chip zener diode http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 mechanical data epoxy:ul94-v0 rated flame retardant case : molded plastic, terminals : solder plated, solderable per mil-std-750, method 2026 polarity : indicated by cathode band mounting position : any weight : 0.09 gram ? ? ? ? ? ? do-214aa / smb approximated 0.213(5.4) 0.197(5.0) 0.016(0.4) typ. 0.142(3.6) 0.126(3.2) 0.075(1.9) 0.067(1.7) 0.032 (0.8) typ. 0.032(0.8) typ. dimensions in inches and (millimeters) smb batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. glass passivated chip junction. standard zener voltage tolerance 5%. low inductance. low profile package. built-in strain relief. lead-free parts meet environmental standards of mil-std-19500 /228 features suffix "-h" indicates halogen-free part, ex.zgfm206v8b-h. ? ? ? ? ? ? ? ? document id issued date revised date revision page. ds-121729 2009/02/10 2010/04/12 b 9 zgfm206v8b thru zgfm20200b t= 75 c l
page 3 note : 5% tolerance of zener voltage for suffix "b" ex: zgfm206v8b is 6.8v 5% formosa ms chip zener diode http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 electrical characteristics (at t =25 c unless otherwise noted) a o marking code zener voltage te s t current zener impedance leakage current ma i zt z@ i zt zt max. i zk i r volts v r z@ i zk zk 7.14 7.88 8.61 9.56 10.50 11.55 12.60 13.65 15.75 16.80 18.90 21.00 23.10 25.20 28.35 31.50 34.65 37.80 40.95 73.5 66.5 61 58 55 50 45.5 41.5 38.5 33.4 31.2 27.8 25.0 22.8 20.8 18.5 16.6 15.1 13.9 2.0 2.0 2.0 3.0 4.0 4.0 4.5 5.0 7.0 8.0 10.0 11.0 12.0 13.0 18.0 20.0 23.0 25.0 2z6v8 2z7v5 2z8v2 2z9v1 2z10 2z11 2z12 2z13 2z15 2z16 2z18 2z20 2z22 2z24 2z27 2z30 2z33 2z36 2z39 1.00 0.50 0.50 0.50 0.50 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 5.0 3.0 3.0 1.0 1.0 0.5 4.0 5.0 6.0 7.0 7.6 8.4 9.1 9.9 11.4 12.2 13.7 15.2 16.7 18.2 20.6 22.8 25.4 27.4 29.7 700 700 700 700 700 700 700 700 700 700 750 750 750 750 750 1000 1000 1000 part no. zgfm206v8b zgfm207v5b ZGFM208V2B zgfm209v1b zgfm2010b zgfm2011b zgfm2012b zgfm2013b zgfm2015b zgfm2016b zgfm2018b zgfm2020b zgfm2022b zgfm2024b zgfm2027b zgfm2030b zgfm2033b zgfm2036b zgfm2039b 45.15 49.35 53.55 58.80 65.10 71.40 12.8 11.6 10.6 9.8 9.0 8.1 30.0 35.0 40.0 48.0 55.0 75.0 2z43 2z47 2z51 2z56 2z62 2z68 0.25 0.25 0.25 0.25 0.25 0.25 32.7 35.8 38.8 42.6 47.1 51.7 1500 1500 1500 2000 2000 2000 zgfm2043b zgfm2047b zgfm2051b zgfm2056b zgfm2062b zgfm2068b 78.75 86.10 95.55 105.0 7.4 6.7 5.5 5.0 90.0 100 125 175 2z75 2z82 2z91 2z100 0.25 0.25 0.25 0.25 56.0 62.2 69.2 76.0 2000 3000 3000 3000 zgfm2075b zgfm2082b zgfm2091b zgfm20100b nom. v@ i zzt (volts) 6.8 7.5 8.2 9.1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 100 min. 6.46 7.13 7.79 8.65 9.50 10.45 11.40 12.35 14.25 15.20 17.10 19.00 20.90 22.80 25.65 28.50 31.35 34.20 37.05 40.85 44.65 48.45 53.20 58.90 64.60 71.25 77.90 86.45 95.00 115.5 126.0 136.5 4.5 4.2 3.8 250 325 400 2z110 2z120 2z130 0.25 0.25 0.25 83.6 91.2 98.8 4000 4500 5000 zgfm20110b zgfm20120b zgfm20130b 157.5 168.0 189.0 210.0 3.3 3.1 2.8 2.5 575 650 725 900 2z150 2z160 2z180 2z200 0.25 0.25 0.25 0.25 114.0 121.6 136.8 152.0 6000 6500 7000 8000 zgfm20150b zgfm20160b zgfm20180b zgfm20200b 110 120 130 150 160 180 200 104.50 114.00 123.50 142.50 152.00 171.00 190.00 9.14 2.0 2z8v7 0.50 4.0 6.6 700 zgfm208v7b 8.7 8.27 6.1 60.0 1500 5.0 5.0 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 document id issued date revised date revision page. ds-121729 2009/02/10 2010/04/12 b 9 zgfm206v8b thru zgfm20200b ma (ua)max ()max ( )max
page 4 fig.1 typical thermal response l fig. 2 maximum surge power fig.4 units to 200 volts vz, zener voltage@izt, (v) fig 5. units to 12 volts vz, temperature coefficient (mv/ c)@izt vz, zener voltage@izt, (v) nominal vz, (v) rating and characteristic curves (zgfm206v8b thru zgfm20200b) http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 0.0001 0.0002 0.0005 0.001 0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 2 5 10 note below 0.1 second, thermal response curve is applicable to any lead length(l) d=0 0.01 0.02 0.05 0.1 0.2 d=0.5 30 20 10 7 5 3 1 0.7 0.5 0.3 duty cycle, d=t1 t2 ppk t1 t2 single pulse tjl=jl(t)ppk repetitive lulses tjl=jl(t,d)ppk jl ( t,d )transient thermal resistance junction-to-lead ( j / w ) 100 70 50 30 20 10 500 250 150 100 50 30 20 10 ppk, peak surge power, ( w ) p.w. pulse width, (ms) rectangular nonrepetitive waveform tj=25 prior to initial pulse 1k 500 200 1 2 5 10 20 100 50 0.0001 0.0002 0.001 0.002 0.005 0.02 0.03 0.05 0.1 ir, reverse leadage, (uadc) @vr as specified in elec. char. table 0.0003 0.0005 0.003 0.01 fig. 3 maximum surge power 0 20 60 80 140 180 40 100 120 160 200 10 20 30 40 50 100 200 range vz, temperature coefficient, ( mv/ c )@izt 3 4 6 8 10 12 -4 -2 0 2 4 6 8 document id issued date revised date revision page. ds-121729 2009/02/10 2010/04/12 b 9
page 5 fig.6 vz = 3.9 thru 10 volts fig. 8 vz = 100 thru 200 volts nominal vz, (v) rating and characteristic curves (zgfm206v8b thru zgfm20200b) http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 iz, zener current ( ma ) iz, zener current ( ma ) jl, junction-lead thermal resistance ( j / w ) fig. 9 typical thermal resistance 01 2 34 9 510 0.1 0.2 1 2 5 20 30 50 100 0.3 0.5 3 10 678 010203040 90 50 100 0.1 0.2 1 2 5 20 30 50 100 0.3 0.5 3 10 60 70 80 fig.7 vz = 12 thru 82 volts vz, zener voltage, (v) vz, zener voltage, (v) iz, zener current ( ma ) 100 120 140 200 0.1 0.2 1 2 5 20 30 50 100 0.3 0.5 3 10 160 180 0 1/8 1/4 3/8 1/2 5/8 3/4 7/8 1 0 10 20 30 40 50 60 70 80 primary path of conduction is through the cathode lead vz, zener voltage, (v) document id issued date revised date revision page. ds-121729 2009/02/10 2010/04/12 b 9 reverse power dissipation (mw) lead temperature ( c) o fig.10-total power dissipation vs. lead temperature 0 0 400 800 1200 1600 2000 2400 40 80 120 160 200
pinning information 1 2 pin1 cathode pin2 anode pin simplified outline symbol page 6 2 1 suggested solder pad layout formosa ms chip zener diode http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 dimensions in inches and (millimeters) a c b b 0.059 (1.50) a 0.142 (3.60) c 0.118 (3.00) package smb document id issued date revised date revision page. ds-121729 2009/02/10 2010/04/12 b 9 zgfm206v8b thru zgfm20200b
page 7 packing information p 0 p 1 e b d f w p a d d 1 d 2 w 1 c t formosa ms chip zener diode http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. item tolerance smb carrier width carrier length carrier depth sprocket hole 13" reel outside diameter 7" reel outside diameter 13" reel inner diameter 7" reel inner diameter feed hole diameter sprocket hole position punch hole position punch hole pitch sprocket hole pitch embossment center reel width overall tape thickness tape width p 0 p 1 e b c d f t w p a d d d 1 d 1 d 2 w 1 symbol 0.1 0.1 0.1 min min 0.5 0.1 0.3 1.0 0.1 0.1 0.1 0.1 0.1 0.1 2.0 2.0 unit:mm 1.50 330.00 178.00 50.00 62.00 13.00 1.75 5.50 8.00 4.00 2.00 0.23 12.00 18.00 note:devices are packed in accor dance with eia standar rs-481-a and specifications listed above. 3.81 5.74 2.24 ds-121729 2009/02/10 2010/04/12 b 9 zgfm206v8b thru zgfm20200b
page 8 formosa ms chip zener diode http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 reel packing smb 4,000 8.0 8,000 337*337*37 330 382*356*392 88,000 17.0 package reel size reel component spacing box inner box reel dia, carton size carton approx. gross weight (kg) (pcs) (m/m) (m/m) (m/m) (pcs) (m/m) (pcs) 13" document id issued date revised date revision page. profile feature soldering condition average ramp-up rate(t to t ) <3 /sec preheat -temperature min(tsmin) 150 -temperature max(tsmax) 200 -time(min to max)(t ) 60~120sec tsmax to t -ramp-uprate <3 /sec time maintained above: -temperature(t ) 217 -time(t ) 60~260sec peak temperature(t ) 255 0/ 5 time within 5 of actual peak temperature(t ) ramp-down rate <6 /sec time 25 to peak temperature <6minutes lp s l l l p p o o o o o oo o o o c c c c c c- + c c c c 3.reflow soldering 10~30sec 1.storage environment: temperature=5 ~40 humidity=55%25% 2.reflow soldering of surface-mount devices oo cc suggested thermal profiles for soldering processes critical zone tl to tp critical zone tl to tp tl tsmax tsmin ramp-up tp ts preheat t25 c to peak o time 25 tl tp ramp-down temperature ds-121729 2009/02/10 2010/04/12 b 9 zgfm206v8b thru zgfm20200b
page 9 formosa ms chip zener diode http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. ds-121729 2009/02/10 2010/04/12 b 9 zgfm206v8b thru zgfm20200b high reliability test capabilities 1. solder resistance 2. solderability 3. high temperature reverse bias 4. pressure cooker 5. temperature cycling 6. humidity 7. high temperature storage life at 260 5 for 10 2sec. at 245 5 for 5 sec. v = 80% at t =150 for 168 hrs. 15p at t =121 for 4 hrs. -55 to +125 dwelled for 30 min. and transferred for 5min. total 10 cycles. at t =85 , rh=85% for 1000hrs. at 175 for 1000 hrs. c c v nom* c c cc c c o o o o oo o o zj sig a a z mil-std-750d method-2031 mil-std-202f method-208 mil-std-750d method-1038 jesd22-a102 mil-std-750d method-1051 mil-std-750d method-1021 mil-std-750d method-1031 item test conditions reference
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